化學(xué)成分 PESD3V3L1BLF

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評(píng)估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934668248515	PESD3V3L1BLFZ	PESD3V3L1BLF	SOD972-S1 (DFN0603)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 65997-17-3: 38702 ppm; substance 1333-86-4: 3001 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 3000 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 5650 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Substrate/Laminate 2	Filler	Glass Fibrous	65997-17-3	0.007740	43.935890	3.870925
Substrate/Laminate 2	Polymer	Resin system		0.006730	38.161130	3.362156
Substrate/Laminate 2	Filler	Non hazardous		0.002890	16.424040	1.447035
Substrate/Laminate 2	Additive	Calcium fluoride	7789-75-5	0.000260	1.478940	0.130325
		Core Total		0.017620	100.000000	8.810441
		Substrate/Laminate 2 Total		0.017620	100.000000	8.810441

Substrate/Laminate 1	Pure metal	Copper (Cu)	7440-50-8	0.012940	100.000000	6.470324
		Foil Total		0.012940	100.000000	6.470324
		Substrate/Laminate 1 Total		0.012940	100.000000	6.470324

Ink	Additive	Barium sulfate (BaSO4)	7727-43-7	0.020060	37.165550	10.029039
Ink	Polymer	Acrylic resin		0.017450	32.341510	8.727318
Ink	Polymer	Bisphenol A-formaldehyde copolymer	25085-75-0	0.006200	11.481260	3.098399
Ink	Additive	Non hazardous		0.003070	5.681120	1.533289
Ink	Additive	Talc	14807-96-6	0.003050	5.642920	1.522979
Ink	Filler	Silica -amorphous-	7631-86-9	0.003020	5.605590	1.512909
Ink	Pigment	Carbon black	1333-86-4	0.000600	1.109130	0.299588
Ink	Polymer	1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde, methylated	68002-20-0	0.000520	0.972920	0.262828
		Ink Total		0.053970	100.000000	26.986349

Die	Doped silicon	Silicon (Si)	7440-21-3	0.011200	89.836550	5.602058
Die	Additive	Silicon Dioxide (SiO2)	14808-60-7	0.000130	1.070090	0.066548
Die	Impurity	Non hazardous		0.000010	0.082700	0.004978
Die	Pure metal layer	Silver (Ag)	7440-22-4	0.001130	9.010660	0.561728
		Die Metallization Total		0.001130	9.010660	0.561728
		Die Total		0.012470	100.000000	6.235312

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.071260	71.650000	35.629729
Mould Compound	Polymer	Polyurethane resin	9009-54-5	0.017900	18.000000	8.950949
Mould Compound	Polymer	Polyimide resin		0.007310	7.350000	3.654979
Mould Compound	Pigment	Non hazardous		0.002980	3.000000	1.491829
		Mould Compound Total		0.099450	100.000000	49.727486

Solder Paste	Tin alloy	Tin (Sn)	7440-31-5	0.003540	99.989990	1.769869
Solder Paste	Impurity	Non hazardous		0.000000	0.010010	0.000219
		Solder Paste Total		0.003540	100.000000	1.770088

		PESD3V3L1BLF Total		0.199990	100.000000	100.000000

Notes
Report created on 2024-11-24 18:18:49 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-11-24 18:18:49 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
基板核心 (Core)	?	?	?	?	?	?
銅箔 (Foil)	?	?	?	?	?	?
墨水 (Ink)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層 (Die Metallization)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-11-24 18:18:49 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

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ESD保護(hù)、TVS、信號(hào)調(diào)節(jié)

MOSFET

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Interactive application notes

Advanced Support Tools

化學(xué)成分 PESD3V3L1BLF

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

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模擬和邏輯IC

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化學(xué)成分 PESD3V3L1BLF

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)