74AHC00-Q100; 74AHCT00-Q100
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AHC00BQ-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | 60 | 4 | low | -40~125 | DHVQFN14 |
| 74AHC00D-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | 60 | 4 | low | -40~125 | SO14 |
| 74AHC00PW-Q100 | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | 60 | 4 | low | -40~125 | TSSOP14 |
| 74AHCT00BQ-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 4 | low | -40~125 | DHVQFN14 |
| 74AHCT00D-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 4 | low | -40~125 | SO14 |
| 74AHCT00PW-Q100 | 4.5?-?5.5 | TTL | ± 8 | 3.3 | 60 | 4 | low | -40~125 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC00BQ-Q100 | 74AHC00BQ-Q100X (935300609115) |
Active | AHC00 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHC00D-Q100 | 74AHC00D-Q100J (935300606118) |
Active | 74AHC00D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHC00PW-Q100 | 74AHC00PW-Q100J (935300608118) |
Active | AHC00 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74AHCT00BQ-Q100 | 74AHCT00BQ-Q100X (935300613115) |
Active | AHT00 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCT00D-Q100 | 74AHCT00D-Q100J (935300611118) |
Active | 74AHCT00D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCT00PW-Q100 | 74AHCT00PW-Q100J (935300612118) |
Active | AHCT00 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC00BQ-Q100 | 74AHC00BQ-Q100X | 74AHC00BQ-Q100 |
|
|
| 74AHC00D-Q100 | 74AHC00D-Q100J | 74AHC00D-Q100 |
|
|
| 74AHC00PW-Q100 | 74AHC00PW-Q100J | 74AHC00PW-Q100 |
|
|
| 74AHCT00BQ-Q100 | 74AHCT00BQ-Q100X | 74AHCT00BQ-Q100 |
|
|
| 74AHCT00D-Q100 | 74AHCT00D-Q100J | 74AHCT00D-Q100 |
|
|
| 74AHCT00PW-Q100 | 74AHCT00PW-Q100J | 74AHCT00PW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT00_Q100 | Quad 2-input NAND gate | Data sheet | 2024-01-15 |
| mna212 | Block diagram: 74LVC132ABQ, 74LVC132AD, 74LVC132APW, 74AHC00BQ, 74AHC00D, 74AHC00PW, 74AHCT00BQ, 74AHCT00D, 74AHCT00PW, 74LV00BQ, 74LV00D, 74LV00DB, 74LV00N, 74LV00PW, 74LVC00ABQ, 74LVC00AD, 74LVC00ADB, 74LVC00APW | Block diagram | 2009-11-04 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc00 | ahc00 IBIS model | IBIS model | 2013-04-08 |
| ahct00 | ahct00 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc00 | ahc00 IBIS model | IBIS model | 2013-04-08 |
| ahct00 | ahct00 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。