74AXP2T08-Q100
參數(shù)類型
型號(hào) |
---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購的器件編號(hào),(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AXP2T08DP-Q100 | 74AXP2T08DP-Q100J (935334222118) |
Withdrawn / End-of-life | r8 |
TSSOP10 (SOT552-1) |
SOT552-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT552-1_118 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AXP2T08DP-Q100 | 74AXP2T08DP-Q100J | 74AXP2T08DP-Q100 |
文檔 (12)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74AXP2T08_Q100 | Dual supply, dual 2-input AND gate | Data sheet | 2019-03-29 |
AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT552-1 | 3D model for products with SOT552-1 package | Design support | 2020-01-22 |
axp2t08 | 74AXP2T08 IBIS model | IBIS model | 2016-03-02 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP10_SOT552_mk | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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