封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BZA956A | BZA956A,115 (934056529115) |
Active | Z1 |
(SOT665) |
SOT665 |
REFLOW_BG-BD-1
|
SOT665_115 |
| BZA962A | BZA962A,115 (934056530115) |
Active | Z2 |
(SOT665) |
SOT665 |
REFLOW_BG-BD-1
|
SOT665_115 |
| BZA968A | BZA968A,115 (934056531115) |
Active | Z3 |
(SOT665) |
SOT665 |
REFLOW_BG-BD-1
|
SOT665_115 |
文檔 (8)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BZA900A_SERIES | Quadruple ESD transient voltage suppressor | Data sheet | 2001-09-02 |
| mgw315 | Block diagram: BZA956A, BZA956AVL, BZA962A, BZA962AVL, BZA968A, BZA968AVL | Block diagram | 2009-11-03 |
| SOT665 | 3D model for products with SOT665 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT665_mk | plastic, surface-mounted package; 5 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Marcom graphics | 2017-01-28 |
| SOT665 | plastic, surface-mounted package; 5 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |