PESDxL5UF; PESDxL5UV; PESDxL5UY
參數(shù)類型
| 型號(hào) | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD3V3L5UF | XSON6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD3V3L5UY | TSSOP6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD5V0L5UF | XSON6 | 5 | Unidirectional | 5 | 16 | 20 |
| PESD5V0L5UY | TSSOP6 | 5 | Unidirectional | 5 | 16 | 20 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 (934061195115) |
Active | A1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD3V3L5UY | PESD3V3L5UY,115 (934057802115) |
Active | K3% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UF | PESD5V0L5UF,115 (934061199115) |
Active | A2 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD5V0L5UY | PESD5V0L5UY,115 (934057803115) |
Active | K4% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UY,125 (934057803125) |
Active | K4% | SOT363_125 | ||||
| PESD5V0L5UYF (934057803135) |
Active | K4% | SOT363_135 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 | PESD3V3L5UF |
|
|
| PESD3V3L5UY | PESD3V3L5UY,115 | PESD3V3L5UY |
|
|
| PESD5V0L5UF | PESD5V0L5UF,115 | PESD5V0L5UF |
|
|
| PESD5V0L5UY | PESD5V0L5UY,115 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UY,125 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UYF | PESD5V0L5UY |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PESDXL5UF_V_Y | Low capacitance unidirectional fivefold ESD protection diode arrays | Data sheet | 2020-05-01 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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Ordering, pricing & availability
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