74AUP2G0604
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G0604GN | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G0604GS | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | XSON6 |
| 74AUP2G0604GW | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM | 74AUP2G0604GMH (935299653125) |
Active | a6 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AUP2G0604GN | 74AUP2G0604GNH (935299654125) |
Active | a6 |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暫無信息 |
| 74AUP2G0604GS | 74AUP2G0604GSH (935299655125) |
Active | a6 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無信息 |
| 74AUP2G0604GW | 74AUP2G0604GWH (935299656125) |
Active | a6 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G0604GM | 74AUP2G0604GMH | 74AUP2G0604GM |
|
|
| 74AUP2G0604GN | 74AUP2G0604GNH | 74AUP2G0604GN |
|
|
| 74AUP2G0604GS | 74AUP2G0604GSH | 74AUP2G0604GS |
|
|
| 74AUP2G0604GW | 74AUP2G0604GWH | 74AUP2G0604GW |
|
|
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP2G0604 | Low-power inverting buffer with open-drain and inverter | Data sheet | 2023-07-24 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復您。
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
Ordering, pricing & availability
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