參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74HC30D-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 36 | 1 | low | -40~125 | SO14 |
| 74HC30PW-Q100 | 2.0?-?6.0 | CMOS | ± 5.2 | 12 | 36 | 1 | low | -40~125 | TSSOP14 |
| 74HCT30D-Q100 | 4.5?-?5.5 | TTL | ± 4 | 12 | 36 | 1 | low | -40~125 | SO14 |
| 74HCT30PW-Q100 | 4.5?-?5.5 | TTL | ± 4 | 12 | 36 | 1 | low | -40~125 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC30D-Q100 | 74HC30D-Q100J (935300224118) |
Active | 74HC30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HC30PW-Q100 | 74HC30PW-Q100J (935300225118) |
Active | HC30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT30D-Q100 | 74HCT30D-Q100J (935300226118) |
Active | 74HCT30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HCT30PW-Q100 | 74HCT30PW-Q100J (935300227118) |
Active | HCT30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC30D-Q100 | 74HC30D-Q100J | 74HC30D-Q100 |
|
|
| 74HC30PW-Q100 | 74HC30PW-Q100J | 74HC30PW-Q100 |
|
|
| 74HCT30D-Q100 | 74HCT30D-Q100J | 74HCT30D-Q100 |
|
|
| 74HCT30PW-Q100 | 74HCT30PW-Q100J | 74HCT30PW-Q100 |
|
|
文檔 (14)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT30_Q100 | 8-input NAND gate | Data sheet | 2024-03-13 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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