外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT429 | TO-247-3 | Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247-3 | TO-247-3 (JEDEC) | 2023-05-24 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT429 | 3D model for products with SOT429 package | Design support | 2023-03-13 |
| TO-247_SOT429_mk | plastic, single-ended through-hole package; 3 leads; 5.45 mm pitch; 20.45 mm x 15.6 mm x 4.95 mm body | Marcom graphics | 2019-02-19 |
| SOT429 | plastic, single-ended through-hole package; 3 leads; 5.45 mm pitch; 20.45 mm x 15.6 mm x 4.95 mm body | Package information | 2020-04-21 |
| SOT429_127 | TO-247; Tube pack; Standard product orientation | Packing information | 2020-04-21 |
采用此封裝的產(chǎn)品
GaN FETs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|