可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
---|---|---|---|---|
PESD2USB30 | PESD2USB30Z | 934069598087 | WLCSP10_4-2-4 | 訂單產(chǎn)品 |
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Click here for more informationESD protection for differential data lines
PESD2USB30 is an ElectroStatic Discharge (ESD) protection device for two differential channels.
It is footprint compatible to PCMF2USB30 common mode filters with ESD protection.
The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
Allows switching between PCMF2USB30 common mode filters with ESD protection and PESD2USB30 ESD protection in the same footprint.
The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
TrEOS process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs).
Industry-standard Wafer-Level Chip Scale package (WLCSP10).
Smartphone, cellular and cordless phone
Tablet PC and Mobile Internet Device (MID)
USB3.1, USB2.0, HDMI2.0, HDMI1.4
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
General-purpose downstream ESD protection for differential data lines
型號 | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
---|---|---|---|---|---|---|
PESD2USB30 | WLCSP10 | 2 | Unidirectional | 5 | 0.45 | 15 |
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
PESD2USB30 | PESD2USB30Z (934069598087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 |
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
PESDXUSB30_SER | ESD protection for differential data lines | Data sheet | 2018-04-17 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | PCMF2USB3X, PCMF2HDMI2X and PESD2USB3X; H500 and H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 | Packing information | 2020-04-27 |
PESD2USB30_Nexperia_Product_Reliability | PESD2USB30 Nexperia Product Reliability | Quality document | 2024-06-14 |
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文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
PESD2USB30 | PESD2USB30Z | 934069598087 | Active | WLCSP10_4-2-4_087 | 4,500 | 訂單產(chǎn)品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.