可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
---|---|---|---|---|
PESD3V3L4UF | PESD3V3L4UF,115 | 934061194115 | SOT886 | 訂單產(chǎn)品 |
進一步了解Nexperia的豐富產(chǎn)品組合,比如二極管、雙極性晶體管、ESD保護器件、MOSFET器件、氮化鎵場效應晶體管(GaN FET)、絕緣柵雙極晶體管(IGBT)以及模擬IC和邏輯IC。我們的器件廣泛應用于汽車、工業(yè)、移動和消費等多個領(lǐng)域,幾乎為世界上所有電子設計提供支持。
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Click here for more informationLow capacitance unidirectional quadruple ESD protection diode arrays
Low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode array in a leadless ultra small SOT886 Surface-Mounted Device (SMD) plastic package, designed to protect up to four signal lines from the damage caused by ESD and other transients.
ESD protection of up to four lines
Low diode capacitance
Max. peak pulse power: PPP = 30 W
Low clamping voltage: VCL = 12 V
Ultra low leakage current: IRM = 75 nA
ESD protection up to 20 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPP = 3 A
Computers and peripherals
Communication systems
Audio and video equipment
Portable electronics
Cellular handsets and accessories
Subscriber Identity Module (SIM) card protection
型號 | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
---|---|---|---|---|---|---|
PESD3V3L4UF | XSON6 | 4 | Unidirectional | 3.3 | 22 | 20 |
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
PESD3V3L4UF | PESD3V3L4UF,115 (934061194115) |
Active | A5 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
PESDXL4UF_G_W | Low capacitance unidirectional quadruple ESD protection diode arrays | Data sheet | 2022-05-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT886_115 | XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
PESD3V3L4UF_Nexperia_Product_Reliability | PESD3V3L4UF Nexperia Product Reliability | Quality document | 2024-04-29 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PESD3V3L4UF | PESD3V3L4UF SPICE model | SPICE model | 2012-07-22 |
PESD3V3L4UF | PESD3V3L4UF SPICE model | SPICE model | 2024-10-14 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
如果您需要設計/技術(shù)支持,請告知我們并填寫 應答表 我們會盡快回復您。
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
PESD3V3L4UF | PESD3V3L4UF SPICE model | SPICE model | 2012-07-22 |
PESD3V3L4UF | PESD3V3L4UF SPICE model | SPICE model | 2024-10-14 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
PESD3V3L4UF | PESD3V3L4UF,115 | 934061194115 | Active | SOT886_115 | 5,000 | 訂單產(chǎn)品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.