可訂購(gòu)部件
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 訂購(gòu)代碼(12NC) | 封裝 | 從經(jīng)銷商處購(gòu)買 |
|---|---|---|---|---|
| PSMNR70-30YLH | PSMNR70-30YLHX | 934660105115 | SOT669 | 訂單產(chǎn)品 |
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Click here for more informationPSMNR70-30YLH
N-channel 30 V, 0.82 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 technology
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package optimized for low RDSon. Low IDSS leakage even when hot, high efficiency and high current rated to 300 A, optimized for DC load switch and hot-swap applications.
Features and benefits
100% avalanche tested at I(AS) = 190 A
Optimized for low RDSon
Low leakage < 1 μA at 25 °C
Low spiking and ringing for low EMI designs
Optimized for 4.5 V gate drive
Copper-clip for low parasitic inductance and resistance
High reliability LFPAK package, qualified to 175 °C
Wave solderable; exposed leads for optimal solder coverage and visual solder inspection
Applications
Hot swap
e-fuse
Power OR-ing
DC switch / Load switch
Battery protection
Brushed and BLDC (brushless) motor control
Synchronous rectification in AC-DC and DC-DC applications
參數(shù)類型
| 型號(hào) | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMNR70-30YLH | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 30 | 0.82 | 1.1 | 175 | 300 | 16 | 46 | 95 | 268 | 50 | 1.5 | N | 5473 | 2836 | 2018-02-12 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PSMNR70-30YLH | PSMNR70-30YLHX (934660105115) |
Active | H7030L |
LFPAK56; Power-SO8 (SOT669) |
SOT669 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT669_115 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PSMNR70-30YLH | PSMNR70-30YLHX | PSMNR70-30YLH |
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文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PSMNR70-30YLH | N-channel 30 V, 0.82 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 technology | Data sheet | 2020-01-01 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2022-05-30 |
| SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
| Reliability_information_t11_sot669 | Reliability qualification information | Quality document | 2022-08-19 |
| T11_SOT669_PSMNR70-30YLH_Nexperia_Quality_document | Product Quality Quick Reference Information | Quality document | 2022-08-19 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| spice3_PSMNR70-30YLH | PSMNR70-30YLH SPICE model | SPICE model | 2019-03-05 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
| PSMNR70-30YLH_RCthermal | PSMNR70-30YLH RC thermal | Thermal design | 2019-03-05 |
| PSMNR70-30YLH | PSMNR70-30YLH thermal model | Thermal model | 2019-03-05 |
| PSMNR70-30YLH_Zth | PSMNR70-30YLH Zth | Thermal model | 2019-03-05 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| spice3_PSMNR70-30YLH | PSMNR70-30YLH SPICE model | SPICE model | 2019-03-05 |
| PSMNR70-30YLH_RCthermal | PSMNR70-30YLH RC thermal | Thermal design | 2019-03-05 |
| PSMNR70-30YLH | PSMNR70-30YLH thermal model | Thermal model | 2019-03-05 |
| PSMNR70-30YLH_Zth | PSMNR70-30YLH Zth | Thermal model | 2019-03-05 |
| SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
訂購(gòu)、定價(jià)與供貨
| 型號(hào) | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購(gòu)買 |
|---|---|---|---|---|---|---|
| PSMNR70-30YLH | PSMNR70-30YLHX | 934660105115 | Active | SOT669_115 | 1,500 | 訂單產(chǎn)品 |
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購(gòu)樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
PSMNR70-30YLH
N-channel 30 V, 0.82 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 technology
從安世半導(dǎo)體購(gòu)買
| SKU | 庫(kù)存* | MOQ | 單位價(jià)格 | 數(shù)量 |
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