外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| OL-IP4369CX4 | WLCSP4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body | 2007-05-25 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| OL-IP4369CX4 | 3D model for products with OL-IP4369CX4 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-IP4369CX4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body | Package information | 2020-04-21 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| IP4369CX4 | ESD protection for high-speed interfaces |