外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOD123W | CFP3 | plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body | 2008-11-06 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
| SOD123W | 3D model for products with SOD123W package | Design support | 2019-01-22 |
| Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封裝的肖特基整流器 | Leaflet | 2022-07-01 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| CFP3_SOD123W_mk | plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOD123W | plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body | Package information | 2020-04-21 |
| SOD123W_115 | Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation | Packing information | 2020-06-11 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| PTVS3V3S1UR | 400 W Transient Voltage Suppressor |
|