外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1023 | LFPAK56E; Power-SO8 | plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch | 2013-03-05 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT1023 | 3D model for products with SOT1023 package | Design support | 2017-06-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| LFPAK56_SOT1023_mk | plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body | Marcom graphics | 2017-01-28 |
| SOT1023 | plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch | Package information | 2024-08-28 |
| SOT1023_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-06-07 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| BUK7J1R0-40H | N-channel 40 V, 1.0 mΩ standard level MOSFET in LFPAK56E |
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