外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT108-1 | SO14 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | MS-012 (JEDEC) | 2023-10-27 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT108-1_112 | SO14; Tube pack; Standard product orientation | Packing information | 2021-09-10 |
| SOT108-1_118 | SO14; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-02-19 |
| SOT108-1_431 | SO14; Reel sulfur barrier pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,431 or Z Ordering code (12NC) ending 431 | Packing information | 2020-04-27 |
| SOT108-1_652 | SO14; Tube pack; Standard product orientation | Packing information | 2021-09-10 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| 74LV08D | Quad 2-input AND gate |
|