外形圖
封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
---|---|---|---|---|
SOT89 | SOT89 | plastic, surface-mounted package; 3 leads; 1.5 mm pitch; 4.5 mm x 2.5 mm x 1.5 mm body | SC-62 (EIAJ); TO-243 (JEDEC) | 2024-10-02 |
相關文檔
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
PBSS4021NX | 20 V, 7 A NPN low VCEsat transistor | Data sheet | 2025-01-16 |
PBSS4041NX | 60 V, 6.2 A NPN low VCEsat transistor | Data sheet | 2025-01-16 |
SOT89 | 3D model for products with SOT89 package | Design support | 2018-12-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT89_mk | plastic, surface-mounted package; 3 leads; 1.5 mm pitch; 4.5 mm x 2.5 mm x 1.5 mm body | Marcom graphics | 2017-01-28 |
SOT89 | plastic, surface-mounted package; 3 leads; 1.5 mm pitch; 4.5 mm x 2.5 mm x 1.5 mm body | Package information | 2024-11-12 |
SOT89_115 | Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2025-01-16 |
SOT89_135 | Reel pack for SMD; 13"; Q2/T3 product orientation | Packing information | 2025-01-16 |
SOT89_146 | Reel pack for SMD; 7"; Q1/T1 product orientation | Packing information | 2025-01-20 |
SOT89_147 | Reel pack for SMD; 7"; Q4/T2 product orientation | Packing information | 2025-01-20 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
型號 | 描述 | 快速訪問 |
---|---|---|
BF623-Q | PNP high-voltage transistor |
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